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Under the new energy wave, the output value of automotive PCBs is expected to reach $9.5 billion

Automotive Flexible Printed Circuit (FPC) technology plays a crucial role in the modern automotive industry. With its flexibility, durability, and high-density design capabilities, FPCs have revolutionized the way electronic systems are integrated into vehicles.

Automotive FPCs are specifically designed to withstand the demanding conditions found in vehicles, such as vibrations, temperature variations, and limited space. These flexible circuit boards provide excellent performance, reliability, and space-saving advantages in automotive applications.

The design and manufacturing of automotive FPCs require specialized expertise and considerations. Design optimization is essential to ensure signal integrity, functionality, and compatibility with other electronic components. Advanced software and manufacturing equipment are utilized to create intricate and compact FPC layouts.

FPC assembly techniques are tailored to meet the automotive industry's stringent requirements. Customized solutions are developed to integrate FPCs seamlessly into various vehicle models, considering factors like size constraints, electrical connectivity, and thermal management.

FPC connectors enable high-speed data transmission, facilitating the seamless integration of electronic control units, communication systems, navigation systems, and automotive sensors. These connectors ensure reliable and efficient signal transmission, enhancing the overall performance of the vehicle's electronic systems.

Flexible circuit materials and substrates used in automotive FPCs are carefully selected to withstand harsh environmental conditions, including temperature extremes, humidity, and exposure to chemicals. The materials' ruggedness ensures long-lasting performance and durability.

In automotive lighting systems, FPCs enable precise control and flexible positioning of LEDs, contributing to enhanced visibility and design aesthetics. The miniaturization of FPCs enables their integration into compact automotive modules, reducing space requirements and weight while maintaining high functionality.

Overall, automotive FPCs have revolutionized the automotive electronics industry. Their flexibility, reliability, and space-saving advantages have paved the way for advanced vehicle communication technology, electronic integration, and the miniaturization of automotive systems. With ongoing advancements in FPC technology, the future of automotive electronics looks promising, ushering in enhanced safety, efficiency, and innovation on the roads.

In recent years, with the increasing penetration rate of electric vehicles as part of the new energy vehicle trend, the core components of automobiles have transitioned from internal combustion engines to the three electric systems. The replacement of traditional fuel vehicles with new energy vehicles has become an irreversible trend. The competition has shifted towards the development of technologies and the competition for resources in the three electric areas.

For automobiles to achieve intelligent upgrades, on one hand, it requires the addition of intelligent modules such as smart cabins and autonomous driving. On the other hand, the integration of intelligence requires the transformation of the vehicle's overall architecture from traditional mechanical systems to a more intelligent electrical and electronic architecture (EEA) in order to support the requirements of intelligent motion control.

The fundamental hardware support for the electrification and intelligence of automobiles lies in automotive electronic modules. With the increasing electronicization of automobiles, the proportion of automotive electronic costs is constantly rising. It is projected that by 2030, the proportion of automotive electronic costs will nearly reach 50%. As the "mother" of electronics, PCBs will also see significant growth in their applications in automobiles. According to CPCA's forecast, the global automotive PCB production value is expected to reach $9.5 billion by 2025, with a compound annual growth rate of 7.8% from 2020 to 2025.

The diversified demand for automotive PCBs includes 4-8 layer boards, which require high product reliability and stability, stable and minimal price fluctuations, and long product certification cycles.

With the trends towards electric and intelligent vehicles, PCB solutions have become more diverse. There is a transition from the traditional focus on 4-6 layer boards to HDI, metal heat dissipation substrates, thick copper substrates, and embedded component boards. The quantity and technical complexity of PCBs per vehicle increase.

The development trend of automotive PCBs includes the need for higher voltage resistance and lower thermal resistance for PCBs due to the increased adoption of 800V high-voltage fast charging. When the charging power voltage of electric vehicles increases, the size of the components also increases, requiring PCB traces to withstand higher currents. Thick copper or embedded copper schemes are often used to avoid issues such as overload, overheating, or controlled reduction of charging currents. Thick copper PCBs are highly multilayered with embedded copper to improve heat dissipation capabilities.

The Battery Management System (BMS) in the automotive industry requires the replacement of wire harnesses with flexible printed circuits (FPC) to achieve lightweight design and space savings.

In high-level perception systems, a combination of software and hardware boards is highly preferred due to the higher reliability requirements. Sensors such as cameras and Lidar will prioritize the use of combined software and hardware interconnect solutions over traditional connectors.

For intelligent cabins, which integrate multiple operating systems and different levels of security functions, to meet the requirements of multi-modal human-machine interaction such as touch, intelligent voice, visual recognition, intelligent display, emerging solutions such as AR-HUD and electronic mirrors have driven the increased usage of high-density interconnect (HDI) PCBs. Core components such as in-car entertainment systems, autonomous driving control, and in-car servers typically utilize high-speed materials with 10 layers or more in 3-step HDI designs.



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